Technical Reference for TPX Release Film
Circuit board TPX film | TPX release film
TPX release film/Opulent TPX film
Overview
TPX release film is a high-performance demolding film that can be used for various purposes, utilizing its excellent demolding and heat resistance,
Using it as a flexible printed substrate (FPC) for circuit boards and demolding in fields such as electronics, display screens, and semiconductors
Type material. TPX film is used in various release, adhesive blocking, filling and other occasions, divided into single-layer and multi-layer types, and has
Multiple models. According to the surface appearance, it can be divided into smooth and frosted surfaces, which need to be selected according to different technical requirements.
Features/advantages:
1. Good heat resistance: It can also be used at high temperatures of 200 ℃. The melting point of TPX is around 230 ℃, which is around 200 ℃
Celsius degree process can also be used;
2. Excellent demolding performance: It can peel off various materials with low surface tension, and has excellent demolding performance for various materials such as epoxy resin;
3. Excellent filling ability: can match complex surface shapes (even at a 90 ° angle),TPX can soften at about 50 ℃ and easily adhere tightly to complex concave convex shapes;
4. Good transparency: Compared to similar products, it has excellent transparency;
5. Low pollution: free from substances that contaminate the surface of products such as silicone and plasticizers;
6. Low density: The TPX density is 0.83, which is lighter than most thin film products and is conducive to transportation and storage.
7. Environmental adaptability: It can be incinerated for easy subsequent treatment by customers;
◆ Scope of application
1. It can be used for flexible printed circuit substrates and hard bent circuit substrates.
2. Can be used for AMC (cutting-edge compliant material), which is a composite material with mechanical strength and heat resistance. TPX can
Used in AMC manufacturing process, it can be used as a demolding film for fiber cloth, carbon fiber, and epoxy resin curing processing.
3. Can be used for sealing semiconductors: With the advancement of IT technology, many semiconductors have been successively introduced, and TPX also
It can be sealed with heat hardening resin and used as a demolding film during curing.
4. TPX film which plays an important role in the development of cutting-edge technology, can be used as a detachment film or separation film when manufacturing cutting-edge technology component materials such as display component materials, solar cell component materials, and high-performance rubber sheets. It can also be used as a film for various industrial fields with both demolding and heat resistance.
◆ Performance data: Physical properties of Opulent
1. Single layer type
TYPE | Single layer Film | |||||||||
Taiwan | Japan | |||||||||
Product Name | X-44BR | X-99BR | X-44B | X-88B | X-88BMT4 | |||||
Thickness | 50UM | 50UM | 25UM | 50UM | 50UM | 100UM | 50UM | 100UM | ||
Item | Unit | Surface Method | GLOSS | GLOSS | GLOSS | GLOSS | GLOSS | GLOSS | Matt Both side | Matt Both side |
Strength at Yield (MD) | MPa | JIS K7127 | twenty-four | thirty-four | twenty-six | twenty-six | thirty-three | thirty | thirty | twenty-nine |
Softening Temp | ℃ | Tohcello * 1 | forty-three | fifty-five | forty-three | forty-three | fifty-five | fifty-five | fifty-five | fifty-five |
Thermaldimensional Change ratio (MD) | % | Tohcello * 1 | one point four | -1.0 | two point two | one point seven | one point nine | one point four | -0.5 | -0.3 |
Thermaldimensional Change Ratio (TD) | % | Tohcello * 1 | -1.0 | zero point three | -1.8 | -1.2 | -1.4 | -1.2 | zero point three | zero point one |
2. Multi layer Type with multiple layers
TYPE | Multi layer Film | ||||||||
Taiwan | Japan | ||||||||
Product Name | CR2040R | CR1012 | CR1012MT4 | CR1033 | CR2031 | CR2031MT4 | CR2031MT6 | ||
Thickness | 120UM | 150UM | 150UM | 150UM | 120UM | 120UM | 120UM | ||
Item | Unit | Surface Method | Gloss | GLOSS | Matt Both side | GLOSS | GLOSS | Matt Both side | Matt Both side |
Strength at Yield (MD) | MPa | JIS K7127 | twenty-three | twenty | seventeen | thirteen | twenty-two | twenty-one | twenty |
Softening Temp | ℃ | Tohcello * 1 | fifty-two | forty-three | forty-three | thirty-four | forty-eight | forty-eight | forty-eight |
Thermaldimensional Change ratio (MD) | % | Tohcello * 1 | -0.5 | zero point nine | zero point four | zero point eight | zero point seven | -1.6 | -1.6 |
Thermaldimensional Change ratio (TD) | % | Tohcello * 1 | -1.0 | -1.2 | -0.6 | -0.9 | -1.0 | zero point four | zero point four |
